Reflow

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Reflow soldering is a process in which a solder paste is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent solder joints. Heating may be accomplished by passing the assembly through a reflow oven, under an infrared lamp, or by soldering individual joints with a hot air pencil. Reflow soldering with long industrial convection ovens is the preferred method of soldering surface mount technology components to a printed circuit board. Each segment of the oven has a regulated temperature, according to the specific thermal requirements of each assembly. Reflow ovens meant specifically for the soldering of surface mount components may also be used for through-hole components by filling the holes with solder paste and inserting the component leads through the paste. Read more

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